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ISSN 2380-4505
Device Packaging Conference Presentations
Vol. 2010, Issue DPC, 2010January 01, 2010 EDT

The European 3D Technology Platform (e-CUBES)

Peter Ramm, Armin Klumpp, Josef Weber, Thomas Fritzsch, Maaike Taklo, Nicolas Lietaer, Walter De Raedt, Thierry Hilt, Pascal Couderc, Christian Val, Alan Mathewson, Kafil M. Razeeb, Frank Stam,
3DChip StackingTSV
https://doi.org/10.4071/2010DPC-ta12
IMAPSource Conference Papers
Ramm, Peter, Armin Klumpp, Josef Weber, Thomas Fritzsch, Maaike Taklo, Nicolas Lietaer, Walter De Raedt, et al. 2010. “The European 3D Technology Platform (e-CUBES).” IMAPSource Proceedings 2010 (DPC): 446–501. https:/​/​doi.org/​10.4071/​2010DPC-ta12.

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