Vol. 2010, Issue DPC, 2010January 01, 2010 EDT
Aerosol Jet® Printing of High Density, 3-D Interconnects for Multi-Chip Packaging
Aerosol Jet® Printing of High Density, 3-D Interconnects for Multi-Chip Packaging
Renn, Michael J., Bruce H. King, Michael O’Reilly, Jeff S. Leal, and Suzette K. Pangrle. 2010. “Aerosol Jet® Printing of High Density, 3-D Interconnects for Multi-Chip Packaging.” IMAPSource Proceedings 2010 (DPC): 2131–52. https://doi.org/10.4071/2010DPC-tha15.
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