Vol. 2010, Issue DPC, 2010January 01, 2010 EDT
Aerosol Jet® Printing of High Density, 3-D Interconnects for Multi-Chip Packaging
Aerosol Jet® Printing of High Density, 3-D Interconnects for Multi-Chip Packaging
Michael J. Renn, Bruce H. King, Michael O'Reilly, Jeff S. Leal, Suzette K. Pangrle,
Renn, Michael J., Bruce H. King, Michael O’Reilly, Jeff S. Leal, and Suzette K. Pangrle. 2010. “Aerosol Jet® Printing of High Density, 3-D Interconnects for Multi-Chip Packaging.” IMAPSource Proceedings 2010 (DPC): 2131–52. https://doi.org/10.4071/2010DPC-tha15.