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Device Packaging Conference Presentations
Vol. 2010, Issue DPC, 2010
January 01, 2010 EDT
Via Last using Polymer Liners and their Reliability
Deniz Sabuncuoglu Tezcan
,
Bivragh Majeed
,
Yann Civale
,
Philippe Soussan
,
Eric Beyne
,
3D interconnect
Through Si via
Polymer liner
•
https://doi.org/10.4071/2010DPC-tp15
IMAPSource Conference Papers
Tezcan, Deniz Sabuncuoglu, Bivragh Majeed, Yann Civale, Philippe Soussan, and Eric Beyne. 2010. “Via Last Using Polymer Liners and Their Reliability.”
IMAPSource Proceedings
2010 (DPC): 831–58.
https://doi.org/10.4071/2010DPC-tp15
.
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