Vol. 2010, Issue DPC, 2010January 01, 2010 EDT
Advanced TSV Copper Electrodeposition for 3D Interconnect Applications
Advanced TSV Copper Electrodeposition for 3D Interconnect Applications
Rozalia Beica, Paul Siblerud, Dave Erickson,
Beica, Rozalia, Paul Siblerud, and Dave Erickson. 2010. “Advanced TSV Copper Electrodeposition for 3D Interconnect Applications.” IMAPSource Proceedings 2010 (DPC): 774–802. https://doi.org/10.4071/2010DPC-tp13.