Vol. 2010, Issue DPC, 2010January 01, 2010 EDT
No Flow Underfill Process Development for Fine Pitch Flip Chip Silicon to Silicon Wafer Level Integration
No Flow Underfill Process Development for Fine Pitch Flip Chip Silicon to Silicon Wafer Level Integration
Zhaozhi Li, John L. Evans, Paul N. Houston, Brian J. Lewis, Daniel F. Baldwin, Sangil Lee, Theodore G. Tessier, Eugene A. Stout,
Li, Zhaozhi, John L. Evans, Paul N. Houston, Brian J. Lewis, Daniel F. Baldwin, Sangil Lee, Theodore G. Tessier, and Eugene A. Stout. 2010. “No Flow Underfill Process Development for Fine Pitch Flip Chip Silicon to Silicon Wafer Level Integration.” IMAPSource Proceedings 2010 (DPC): 708–35. https://doi.org/10.4071/2010DPC-ta32.