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Device Packaging Conference Presentations
Vol. 2010, Issue DPC, 2010
January 01, 2010 EDT
Journey Toward Process Convergence in TSV Technology
Sesh Ramaswami
,
John Dukovic
,
TSV
3D IC
Stacking
Etch
CVD
PVD
ECD
CMP
Via First
Via Middle
Via Last
•
https://doi.org/10.4071/2010DPC-wa15
IMAPSource Conference Papers
Ramaswami, Sesh, and John Dukovic. 2010. “Journey Toward Process Convergence in TSV Technology.”
IMAPSource Proceedings
2010 (DPC): 1282–1321.
https://doi.org/10.4071/2010DPC-wa15
.
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