TLP Bonding Technologies for Micro Joining and 3D Packaging

Kei Murayama; Mitsuhiro Aizawa; Mitsutoshi Higashi

doi:10.4071/2010DPC-wa12

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Murayama, Kei, Mitsuhiro Aizawa, and Mitsutoshi Higashi. 2010. “TLP Bonding Technologies for Micro Joining and 3D Packaging.” IMAPSource Proceedings 2010 (DPC): 1221–52. https://doi.org/10.4071/2010DPC-wa12.

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