Vol. 2010, Issue DPC, 2010January 01, 2010 EDT
TLP Bonding Technologies for Micro Joining and 3D Packaging
TLP Bonding Technologies for Micro Joining and 3D Packaging
Kei Murayama, Mitsuhiro Aizawa, Mitsutoshi Higashi,
Murayama, Kei, Mitsuhiro Aizawa, and Mitsutoshi Higashi. 2010. “TLP Bonding Technologies for Micro Joining and 3D Packaging.” IMAPSource Proceedings 2010 (DPC): 1221–52. https://doi.org/10.4071/2010DPC-wa12.