ISSN 2380-4505
Vol. 2010, Issue DPC, 2010January 01, 2010 EDT
Enabling Thin Wafer Metal to Metal Bonding through Integration of High Temperature Polyimide Adhesives and Effective Copper Surface Cleaners
Enabling Thin Wafer Metal to Metal Bonding through Integration of High Temperature Polyimide Adhesives and Effective Copper Surface Cleaners
Anthony B. Rardin, Simon J. Kirk, Mel P Zussmann,
Rardin, Anthony B., Simon J. Kirk, and Mel P Zussmann. 2010. “Enabling Thin Wafer Metal to Metal Bonding through Integration of High Temperature Polyimide Adhesives and Effective Copper Surface Cleaners.” IMAPSource Proceedings 2010 (DPC): 1008–29. https://doi.org/10.4071/2010DPC-tp32.