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Device Packaging Conference Presentations
Vol. 2010, Issue DPC, 2010January 01, 2010 EDT

Enabling Thin Wafer Metal to Metal Bonding through Integration of High Temperature Polyimide Adhesives and Effective Copper Surface Cleaners

Anthony B. Rardin, Simon J. Kirk, Mel P Zussmann,
Thin Wafer HandlingBondingstacking
https://doi.org/10.4071/2010DPC-tp32
IMAPSource Conference Papers
Rardin, Anthony B., Simon J. Kirk, and Mel P Zussmann. 2010. “Enabling Thin Wafer Metal to Metal Bonding through Integration of High Temperature Polyimide Adhesives and Effective Copper Surface Cleaners.” IMAPSource Proceedings 2010 (DPC): 1008–29. https:/​/​doi.org/​10.4071/​2010DPC-tp32.
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