Vol. 2010, Issue DPC, 2010January 01, 2010 EDT
Enabling Thin Wafer Metal to Metal Bonding through Integration of High Temperature Polyimide Adhesives and Effective Copper Surface Cleaners
Enabling Thin Wafer Metal to Metal Bonding through Integration of High Temperature Polyimide Adhesives and Effective Copper Surface Cleaners
Rardin, Anthony B., Simon J. Kirk, and Mel P Zussmann. 2010. “Enabling Thin Wafer Metal to Metal Bonding through Integration of High Temperature Polyimide Adhesives and Effective Copper Surface Cleaners.” IMAPSource Proceedings 2010 (DPC): 1008–29. https://doi.org/10.4071/2010DPC-tp32.
Powered by Scholastica, the modern academic journal management system