Vol. 2010, Issue DPC, 2010January 01, 2010 EDT
Characterization of Wafer Level Metal Thermo-Compression Bonding
Characterization of Wafer Level Metal Thermo-Compression Bonding
Erkan Cakmak, Bioh Kim, Viorel Dragoi,
Cakmak, Erkan, Bioh Kim, and Viorel Dragoi. 2010. “Characterization of Wafer Level Metal Thermo-Compression Bonding.” IMAPSource Proceedings 2010 (DPC): 2326–60. https://doi.org/10.4071/2010DPC-tha34.