Vol. 2010, Issue DPC, 2010January 01, 2010 EDT
ZoneBOND™ Thin Wafer Support Process for Wafer Bonding Applications
ZoneBOND™ Thin Wafer Support Process for Wafer Bonding Applications
Jeremy McCutcheon, Robert Brown, JoElle Dachsteiner,
McCutcheon, Jeremy, Robert Brown, and JoElle Dachsteiner. 2010. “ZoneBONDTM Thin Wafer Support Process for Wafer Bonding Applications.” IMAPSource Proceedings 2010 (DPC): 1080–94. https://doi.org/10.4071/2010DPC-tp35.