Vol. 2010, Issue DPC, 2010January 01, 2010 EDT
Analysis of Silicon Micromachining by UV Lasers, and Implications for Full Cut Laser Dicing of Ultra-Thin Semiconductor Device Wafers
Analysis of Silicon Micromachining by UV Lasers, and Implications for Full Cut Laser Dicing of Ultra-Thin Semiconductor Device Wafers
Hooper, Andy, and Daragh Finn. 2010. “Analysis of Silicon Micromachining by UV Lasers, and Implications for Full Cut Laser Dicing of Ultra-Thin Semiconductor Device Wafers.” IMAPSource Proceedings 2010 (DPC): 1743–59. https://doi.org/10.4071/2010DPC-wp16.
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