Vol. 2010, Issue DPC, 2010January 01, 2010 EDT
Contract Wafer Bumping of Compound Semiconductors
Contract Wafer Bumping of Compound Semiconductors
Andrew Strandjord, Thorsten Teutsch, Axel Scheffler, Bernd Otto, Jing Li,
Strandjord, Andrew, Thorsten Teutsch, Axel Scheffler, Bernd Otto, and Jing Li. 2010. “Contract Wafer Bumping of Compound Semiconductors.” IMAPSource Proceedings 2010 (DPC): 2225–48. https://doi.org/10.4071/2010DPC-tha23.