Vol. 2010, Issue DPC, 2010January 01, 2010 EDT
Integration of Electrografted Layers for the Metallization of Deep TSVs
Integration of Electrografted Layers for the Metallization of Deep TSVs
Claudio Truzzi, F. Raynal, V. Mevellec, N. Frederich, D. Suhr, I. Bispo, B. Couturier,
Truzzi, Claudio, F. Raynal, V. Mevellec, N. Frederich, D. Suhr, I. Bispo, and B. Couturier. 2010. “Integration of Electrografted Layers for the Metallization of Deep TSVs.” IMAPSource Proceedings 2010 (DPC): 803–30. https://doi.org/10.4071/2010DPC-tp14.