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Device Packaging Conference Presentations
Vol. 2010, Issue DPC, 2010January 01, 2010 EDT

Integration of Electrografted Layers for the Metallization of Deep TSVs

Claudio Truzzi, F. Raynal, V. Mevellec, N. Frederich, D. Suhr, I. Bispo, B. Couturier,
Through Silicon ViaElectrografting3D-IC
https://doi.org/10.4071/2010DPC-tp14
IMAPSource Conference Papers
Truzzi, Claudio, F. Raynal, V. Mevellec, N. Frederich, D. Suhr, I. Bispo, and B. Couturier. 2010. “Integration of Electrografted Layers for the Metallization of Deep TSVs.” IMAPSource Proceedings 2010 (DPC): 803–30. https:/​/​doi.org/​10.4071/​2010DPC-tp14.
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