Integration of Electrografted Layers for the Metallization of Deep TSVs

Claudio Truzzi; F. Raynal; V. Mevellec; N. Frederich; D. Suhr; I. Bispo; B. Couturier

doi:10.4071/2010DPC-tp14

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Truzzi, Claudio, F. Raynal, V. Mevellec, N. Frederich, D. Suhr, I. Bispo, and B. Couturier. 2010. “Integration of Electrografted Layers for the Metallization of Deep TSVs.” IMAPSource Proceedings 2010 (DPC): 803–30. https://doi.org/10.4071/2010DPC-tp14.

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