Vol. 2010, Issue DPC, 2010January 01, 2010 EDT
A High Performance and Cost Effective Molded Array Package Substrate
A High Performance and Cost Effective Molded Array Package Substrate
Philip E. Rogren, Pierangelo Magni, Maura Mazzola, Mark Shaw, Giovanni Graziosi, Claudio Maria Villa,
Rogren, Philip E., Pierangelo Magni, Maura Mazzola, Mark Shaw, Giovanni Graziosi, and Claudio Maria Villa. 2010. “A High Performance and Cost Effective Molded Array Package Substrate.” IMAPSource Proceedings 2010 (DPC): 1607–11. https://doi.org/10.4071/2010DPC-Poster2.