ISSN 2380-4505
Vol. 2010, Issue DPC, 2010January 01, 2010 EDT
Next Generation System in a Package Manufacturing by Embedded Chip Technologies
Next Generation System in a Package Manufacturing by Embedded Chip Technologies
Lars Boettcher, A. Ostmann, D. Manessis, S. Karaszkiewicz, H. Reichl,
Boettcher, Lars, A. Ostmann, D. Manessis, S. Karaszkiewicz, and H. Reichl. 2010. “Next Generation System in a Package Manufacturing by Embedded Chip Technologies.” IMAPSource Proceedings 2010 (DPC): 2075–2103. https://doi.org/10.4071/2010DPC-tha13.