Vol. 2010, Issue DPC, 2010January 01, 2010 EDT
A Review of Wafer Coating Methods for 3D Packaging
A Review of Wafer Coating Methods for 3D Packaging
Steven J. Adamson, James Klocke, Gareth De Sanctis,
Adamson, Steven J., James Klocke, and Gareth De Sanctis. 2010. “A Review of Wafer Coating Methods for 3D Packaging.” IMAPSource Proceedings 2010 (DPC): 2153–88. https://doi.org/10.4071/2010DPC-tha16.