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Device Packaging Conference Presentations
Vol. 2010, Issue DPC, 2010January 01, 2010 EDT

A Review of Wafer Coating Methods for 3D Packaging

Steven J. Adamson, James Klocke, Gareth De Sanctis,
Wafercoatingbackside
https://doi.org/10.4071/2010DPC-tha16
IMAPSource Conference Papers
Adamson, Steven J., James Klocke, and Gareth De Sanctis. 2010. “A Review of Wafer Coating Methods for 3D Packaging.” IMAPSource Proceedings 2010 (DPC): 2153–88. https:/​/​doi.org/​10.4071/​2010DPC-tha16.
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