Vol. 2010, Issue DPC, 2010January 01, 2010 EDT
Thin Film Packaging Reinforcement for Overmolded MEMS
Thin Film Packaging Reinforcement for Overmolded MEMS
Gillot Charlotte, Jean-Louis Pornin, Christophe Billard, Emannuelle Lagoute, Mihel Pellat, Guy Parat, Nicolas Sillon,
Charlotte, Gillot, Jean-Louis Pornin, Christophe Billard, Emannuelle Lagoute, Mihel Pellat, Guy Parat, and Nicolas Sillon. 2010. “Thin Film Packaging Reinforcement for Overmolded MEMS.” IMAPSource Proceedings 2010 (DPC): 1095–1119. https://doi.org/10.4071/2010DPC-tp36.