3D TSV Interposer Technology with Cu/SnAg Microbump Interconnections

Seung Wook Yoon; Dzafir Shariff; Jae Hun Ku; Pandi Chelvam Marimuthu; Flynn Carson

doi:10.4071/2010DPC-wa11

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Yoon, Seung Wook, Dzafir Shariff, Jae Hun Ku, Pandi Chelvam Marimuthu, and Flynn Carson. 2010. “3D TSV Interposer Technology with Cu/SnAg Microbump Interconnections.” IMAPSource Proceedings 2010 (DPC): 1–18. https://doi.org/10.4071/2010DPC-wa11.

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