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Device Packaging Conference Presentations
Vol. 2010, Issue DPC, 2010
January 01, 2010 EDT
3D TSV Interposer Technology with Cu/SnAg Microbump Interconnections
Seung Wook Yoon
,
Dzafir Shariff
,
Jae Hun Ku
,
Pandi Chelvam Marimuthu
,
Flynn Carson
,
TSV technology
Silicon interposer technology
Microbump technology
•
https://doi.org/10.4071/2010DPC-wa11
IMAPSource Conference Papers
Yoon, Seung Wook, Dzafir Shariff, Jae Hun Ku, Pandi Chelvam Marimuthu, and Flynn Carson. 2010. “3D TSV Interposer Technology with Cu/SnAg Microbump Interconnections.”
IMAPSource Proceedings
2010 (DPC): 1–18.
https://doi.org/10.4071/2010DPC-wa11
.
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