ISSN 2380-4505
Vol. 2010, Issue DPC, 2010January 01, 2010 EDT
3D TSV Interposer Technology with Cu/SnAg Microbump Interconnections
3D TSV Interposer Technology with Cu/SnAg Microbump Interconnections
Seung Wook Yoon, Dzafir Shariff, Jae Hun Ku, Pandi Chelvam Marimuthu, Flynn Carson,
Yoon, Seung Wook, Dzafir Shariff, Jae Hun Ku, Pandi Chelvam Marimuthu, and Flynn Carson. 2010. “3D TSV Interposer Technology with Cu/SnAg Microbump Interconnections.” IMAPSource Proceedings 2010 (DPC): 1–18. https://doi.org/10.4071/2010DPC-wa11.