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Device Packaging Conference Presentations
Vol. 2010, Issue DPC, 2010
January 01, 2010 EDT
Underfill Design for Low-k Dielectrics and Lead Free Applications
Brian Schmaltz
,
Yukinari Abe
,
Kazuyuki Kohara
,
Flip Chip
Underfill
Low-K Dielectric
•
https://doi.org/10.4071/2010DPC-wa34
IMAPSource Conference Papers
Schmaltz, Brian, Yukinari Abe, and Kazuyuki Kohara. 2010. “Underfill Design for Low-k Dielectrics and Lead Free Applications.”
IMAPSource Proceedings
2010 (DPC): 1465–85.
https://doi.org/10.4071/2010DPC-wa34
.
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