Skip to main content
null
IMAPSource Conference Papers
  • Menu
  • Articles
    • Ceramics Conference Papers
    • Device Packaging Conference Presentations
    • EMPC Conference Proceedings (IMAPS Europe)
    • General
    • High Temperature Conference Papers
    • IMAPS Chapter Conferences
    • Symposium Proceedings
    • All
  • For Authors
  • Editorial Board
  • About
  • Issues
  • Journal Micro & Elect Pkg
  • search

RSS Feed

Enter the URL below into your favorite RSS reader.

http://localhost:46283/feed
Device Packaging Conference Presentations
Vol. 2010, Issue DPC, 2010January 01, 2010 EDT

Underfill Design for Low-k Dielectrics and Lead Free Applications

Brian Schmaltz, Yukinari Abe, Kazuyuki Kohara,
Flip ChipUnderfillLow-K Dielectric
https://doi.org/10.4071/2010DPC-wa34
IMAPSource Conference Papers
Schmaltz, Brian, Yukinari Abe, and Kazuyuki Kohara. 2010. “Underfill Design for Low-k Dielectrics and Lead Free Applications.” IMAPSource Proceedings 2010 (DPC): 1465–85. https:/​/​doi.org/​10.4071/​2010DPC-wa34.
Save article as...▾

View more stats

This website uses cookies

We use cookies to enhance your experience and support COUNTER Metrics for transparent reporting of readership statistics. Cookie data is not sold to third parties or used for marketing purposes.

Powered by Scholastica, the modern academic journal management system