Vol. 2010, Issue DPC, 2010January 01, 2010 EDT
Electroplated Copper Pillar Feature Effects
Electroplated Copper Pillar Feature Effects
Jim Zhang, Arthur Keigler, Zhen Liu, Richard Hollman,
Zhang, Jim, Arthur Keigler, Zhen Liu, and Richard Hollman. 2010. “Electroplated Copper Pillar Feature Effects.” IMAPSource Proceedings 2010 (DPC): 1426–42. https://doi.org/10.4071/2010DPC-wa32.