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Device Packaging Conference Presentations
Vol. 2010, Issue DPC, 2010January 01, 2010 EDT

Electroplated Copper Pillar Feature Effects

Jim Zhang, Arthur Keigler, Zhen Liu, Richard Hollman,
Copper PillarsElectroplatingWLCSP
https://doi.org/10.4071/2010DPC-wa32
IMAPSource Conference Papers
Zhang, Jim, Arthur Keigler, Zhen Liu, and Richard Hollman. 2010. “Electroplated Copper Pillar Feature Effects.” IMAPSource Proceedings 2010 (DPC): 1426–42. https:/​/​doi.org/​10.4071/​2010DPC-wa32.
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