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Device Packaging Conference Presentations
Vol. 2010, Issue DPC, 2010
January 01, 2010 EDT
Electroplated Copper Pillar Feature Effects
Jim Zhang
,
Arthur Keigler
,
Zhen Liu
,
Richard Hollman
,
Copper Pillars
Electroplating
WLCSP
•
https://doi.org/10.4071/2010DPC-wa32
IMAPSource Conference Papers
Zhang, Jim, Arthur Keigler, Zhen Liu, and Richard Hollman. 2010. “Electroplated Copper Pillar Feature Effects.”
IMAPSource Proceedings
2010 (DPC): 1426–42.
https://doi.org/10.4071/2010DPC-wa32
.
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