ISSN 2380-4505
Vol. 2010, Issue DPC, 2010January 01, 2010 EDT
Coreless Substrate Design, Assembly and Reliability for High Speed Applications
Coreless Substrate Design, Assembly and Reliability for High Speed Applications
Jon Aday, Nozad Karim, Mike Devita, Steven Lee,
Aday, Jon, Nozad Karim, Mike Devita, and Steven Lee. 2010. “Coreless Substrate Design, Assembly and Reliability for High Speed Applications.” IMAPSource Proceedings 2010 (DPC): 1486–1513. https://doi.org/10.4071/2010DPC-wa35.