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Device Packaging Conference Presentations
Vol. 2010, Issue DPC, 2010
January 01, 2010 EDT
Coreless Substrate Design, Assembly and Reliability for High Speed Applications
Jon Aday
,
Nozad Karim
,
Mike Devita
,
Steven Lee
,
Coreless
HighSpeed
Assembly
•
https://doi.org/10.4071/2010DPC-wa35
IMAPSource Conference Papers
Aday, Jon, Nozad Karim, Mike Devita, and Steven Lee. 2010. “Coreless Substrate Design, Assembly and Reliability for High Speed Applications.”
IMAPSource Proceedings
2010 (DPC): 1486–1513.
https://doi.org/10.4071/2010DPC-wa35
.
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