Huffman, Alan, Jason Reed, Matthew Lueck, Christopher Gregory, Dorota Temple, and Russ Stapleton. 2010. “Evaluation of Cu/Sn-Cu Bump Bonding Processes for 3D Integration Using a Fluxing Adhesive.”
IMAPSource Proceedings 2010 (DPC): 1726–42.
https://doi.org/10.4071/2010DPC-wp15.