Evaluation of Cu/Sn-Cu Bump Bonding Processes for 3D Integration Using a Fluxing Adhesive

Alan Huffman; Jason Reed; Matthew Lueck; Christopher Gregory; Dorota Temple; Russ Stapleton

doi:10.4071/2010DPC-wp15

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Huffman, Alan, Jason Reed, Matthew Lueck, Christopher Gregory, Dorota Temple, and Russ Stapleton. 2010. “Evaluation of Cu/Sn-Cu Bump Bonding Processes for 3D Integration Using a Fluxing Adhesive.” IMAPSource Proceedings 2010 (DPC): 1726–42. https://doi.org/10.4071/2010DPC-wp15.

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