Vol. 2010, Issue DPC, 2010January 01, 2010 EDT
3D Modeling of Complex Combinations of Dies, Packages, Lead Frames, Sockets and Test Boards for Electrical, Thermal and Manufacturing Verification of Advanced Semiconductor Devices
3D Modeling of Complex Combinations of Dies, Packages, Lead Frames, Sockets and Test Boards for Electrical, Thermal and Manufacturing Verification of Advanced Semiconductor Devices
Sovinsky, John. 2010. “3D Modeling of Complex Combinations of Dies, Packages, Lead Frames, Sockets and Test Boards for Electrical, Thermal and Manufacturing Verification of Advanced Semiconductor Devices.” IMAPSource Proceedings 2010 (DPC): 1656–95. https://doi.org/10.4071/2010DPC-wp11.
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