Vol. 2010, Issue DPC, 2010January 01, 2010 EDT
Improved Heat Dissipation and Optical Performance of High-power LED Packaging with Sintered Nanosilver Die-attach Material
Improved Heat Dissipation and Optical Performance of High-power LED Packaging with Sintered Nanosilver Die-attach Material
Paul Panaccione, Tao Wang, Guo-Quan Lu, Xu Chen, Susan Luo,
Panaccione, Paul, Tao Wang, Guo-Quan Lu, Xu Chen, and Susan Luo. 2010. “Improved Heat Dissipation and Optical Performance of High-Power LED Packaging with Sintered Nanosilver Die-Attach Material.” IMAPSource Proceedings 2010 (DPC): 1585–1605. https://doi.org/10.4071/2010DPC-wa44.