Loading [Contrib]/a11y/accessibility-menu.js
IMAPSource Conference Papers
Menu
Articles
Ceramics Conference Papers
Device Packaging Conference Presentations
General
High Temperature Conference Papers
IMAPS Chapter Conferences
Symposium Proceedings
All
For Authors
Editorial Board
About
Issues
Journal Micro & Elect Pkg
search
Sorry, something went wrong. Please try your search again.
×
Use advanced search instead (articles only)
Articles
Blog posts
RSS Feed
Enter the URL below into your favorite RSS reader.
https://imapsource.org/feed
×
High Temperature Conference Papers
Vol. 2014, Issue HITEC, 2014
January 01, 2014 EDT
Pressureless, Low Temperature Sintering of Micro-scale Silver Paste for Die Attach for 300°C Applications
Fang Yu
,
R. Wayne Johnson
,
Michael Hamilton
,
High temperature operation
die attach
sintered Ag
reliability
•
https://doi.org/10.4071/HITEC-WA21
IMAPSource Conference Papers
Yu, Fang, R. Wayne Johnson, and Michael Hamilton. 2014. “Pressureless, Low Temperature Sintering of Micro-Scale Silver Paste for Die Attach for 300°C Applications.”
IMAPSource Proceedings
2014 (HITEC): 165–71.
https://doi.org/10.4071/HITEC-WA21
.
Save article as...
▾
PDF
XML
Citation (BibTeX)
View more stats