Vol. 2014, Issue HITEC, 2014January 01, 2014 EDT
Pressureless, Low Temperature Sintering of Micro-scale Silver Paste for Die Attach for 300°C Applications
Pressureless, Low Temperature Sintering of Micro-scale Silver Paste for Die Attach for 300°C Applications
Yu, Fang, R. Wayne Johnson, and Michael Hamilton. 2014. “Pressureless, Low Temperature Sintering of Micro-Scale Silver Paste for Die Attach for 300°C Applications.” IMAPSource Proceedings 2014 (HITEC): 165–71. https://doi.org/10.4071/HITEC-WA21.
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