Vol. 2014, Issue HITEC, 2014January 01, 2014 EDT
Uniqueness and Challenges of Sintered Silver as a Bonded Interface Material
Uniqueness and Challenges of Sintered Silver as a Bonded Interface Material
A. A. Wereszczak, Z. Liang, M. K. Ferber, L. D. Marlino,
Wereszczak, A. A., Z. Liang, M. K. Ferber, and L. D. Marlino. 2014. “Uniqueness and Challenges of Sintered Silver as a Bonded Interface Material.” IMAPSource Proceedings 2014 (HITEC): 178–87. https://doi.org/10.4071/HITEC-WA23.