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High Temperature Conference Papers
Vol. 2014, Issue HITEC, 2014
January 01, 2014 EDT
High Temperature Laminate Characterization
David Shaddock
,
Liang Yin
,
High Temperature Electronics
High Temperature Packaging
Reliability
•
https://doi.org/10.4071/HITEC-WP21
IMAPSource Conference Papers
Shaddock, David, and Liang Yin. 2014. “High Temperature Laminate Characterization.”
IMAPSource Proceedings
2014 (HITEC): 235–45.
https://doi.org/10.4071/HITEC-WP21
.
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