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ISSN 2380-4505
High Temperature Conference Papers
Vol. 2014, Issue HITEC, 2014January 01, 2014 EDT

High Temperature Laminate Characterization

David Shaddock, Liang Yin,
High Temperature ElectronicsHigh Temperature PackagingReliability
https://doi.org/10.4071/HITEC-WP21
IMAPSource Conference Papers
Shaddock, David, and Liang Yin. 2014. “High Temperature Laminate Characterization.” IMAPSource Proceedings 2014 (HITEC): 235–45. https:/​/​doi.org/​10.4071/​HITEC-WP21.

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