Vol. 2014, Issue HITEC, 2014January 01, 2014 EDT
The melting-point increase of Sn-Bi solder joint by Cu particles addition
The melting-point increase of Sn-Bi solder joint by Cu particles addition
Omid Mokhtari, Hiroshi Nishikawa,
Mokhtari, Omid, and Hiroshi Nishikawa. 2014. “The Melting-Point Increase of Sn-Bi Solder Joint by Cu Particles Addition.” IMAPSource Proceedings 2014 (HITEC): 333–39. https://doi.org/10.4071/HITEC-THA22.