Vol. 2014, Issue HITEC, 2014January 01, 2014 EDT
Modeling of Thermomechanical Behaviour of Wire Bonded Electronic Devices under Combined Thermal and Vibration Loads
Modeling of Thermomechanical Behaviour of Wire Bonded Electronic Devices under Combined Thermal and Vibration Loads
R. Man, C. Liu, M. Mirgkizoudi, S. Riches,
Man, R., C. Liu, M. Mirgkizoudi, and S. Riches. 2014. “Modeling of Thermomechanical Behaviour of Wire Bonded Electronic Devices under Combined Thermal and Vibration Loads.” IMAPSource Proceedings 2014 (HITEC): 263–70. https://doi.org/10.4071/HITEC-WP25.