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ISSN 2380-4505
High Temperature Conference Papers
Vol. 2014, Issue HITEC, 2014January 01, 2014 EDT

Development of low temperature sintered nano silver pastes using MO technology and resin reinforcing technology

Koji Sasaki, Noritsuka Mizumura,
low temperaturesinterednano silver pasteMO Technologyresinthick film400Csintering
https://doi.org/10.4071/HITEC-WA22
IMAPSource Conference Papers
Sasaki, Koji, and Noritsuka Mizumura. 2014. “Development of Low Temperature Sintered Nano Silver Pastes Using MO Technology and Resin Reinforcing Technology.” IMAPSource Proceedings 2014 (HITEC): 172–77. https:/​/​doi.org/​10.4071/​HITEC-WA22.

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