Extreme thermal resistance of all-polyimide bondlines with TPI adhesive

Jim Fraivillig

doi:10.4071/HITEC-WP22

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Fraivillig, Jim. 2014. “Extreme Thermal Resistance of All-Polyimide Bondlines with TPI Adhesive.” IMAPSource Proceedings 2014 (HITEC): 246–48. https://doi.org/10.4071/HITEC-WP22.

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