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High Temperature Conference Papers
Vol. 2014, Issue HITEC, 2014
January 01, 2014 EDT
Extreme thermal resistance of all-polyimide bondlines with TPI adhesive
Jim Fraivillig
,
thermal resistance
TPI
adhesive
polyimide bondline
•
https://doi.org/10.4071/HITEC-WP22
IMAPSource Conference Papers
Fraivillig, Jim. 2014. “Extreme Thermal Resistance of All-Polyimide Bondlines with TPI Adhesive.”
IMAPSource Proceedings
2014 (HITEC): 246–48.
https://doi.org/10.4071/HITEC-WP22
.
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