ISSN 2380-4505
Vol. 2014, Issue HITEC, 2014January 01, 2014 EDT
Characterization of AgBiX™ Solder Paste on Thick Film for 200°C Applications
Characterization of AgBiX™ Solder Paste on Thick Film for 200°C Applications
Zhenzhen Shen, Wayne Johnson, Michael C. Hamilton,
Shen, Zhenzhen, Wayne Johnson, and Michael C. Hamilton. 2014. “Characterization of AgBiXTM Solder Paste on Thick Film for 200°C Applications.” IMAPSource Proceedings 2014 (HITEC): 340–46. https://doi.org/10.4071/HITEC-THA23.