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High Temperature Conference Papers
Vol. 2014, Issue HITEC, 2014January 01, 2014 EDT

Characterization of AgBiX™ Solder Paste on Thick Film for 200°C Applications

Zhenzhen Shen, Wayne Johnson, Michael C. Hamilton,
Thick film soldering die attach
• https://doi.org/10.4071/HITEC-THA23
IMAPSource Conference Papers
Shen, Zhenzhen, Wayne Johnson, and Michael C. Hamilton. 2014. “Characterization of AgBiXTM Solder Paste on Thick Film for 200°C Applications.” IMAPSource Proceedings 2014 (HITEC): 340–46. https://doi.org/10.4071/HITEC-THA23.
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