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High Temperature Conference Papers
Vol. 2014, Issue HITEC, 2014
January 01, 2014 EDT
Characterization of AgBiX™ Solder Paste on Thick Film for 200°C Applications
Zhenzhen Shen
,
Wayne Johnson
,
Michael C. Hamilton
,
Thick film
soldering
die attach
•
https://doi.org/10.4071/HITEC-THA23
IMAPSource Conference Papers
Shen, Zhenzhen, Wayne Johnson, and Michael C. Hamilton. 2014. “Characterization of AgBiX
TM
Solder Paste on Thick Film for 200°C Applications.”
IMAPSource Proceedings
2014 (HITEC): 340–46.
https://doi.org/10.4071/HITEC-THA23
.
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