Characterization of AgBiX™ Solder Paste on Thick Film for 200°C Applications

Zhenzhen Shen; Wayne Johnson; Michael C. Hamilton

doi:10.4071/HITEC-THA23

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Shen, Zhenzhen, Wayne Johnson, and Michael C. Hamilton. 2014. “Characterization of AgBiX^TM Solder Paste on Thick Film for 200°C Applications.” IMAPSource Proceedings 2014 (HITEC): 340–46. https://doi.org/10.4071/HITEC-THA23.

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