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Device Packaging Conference Presentations
Vol. 2014, Issue DPC, 2014January 01, 2014 EDT

Optimized TSV Module for High Performance 2.5D Device Packaging

Cyprian Uzoh, Liang Wang, Zhuowen Sun, Andrew Cao, Bong-Sub Lee, Guilian Gao, Hong Shen, Sitaram Arkalgud,
Through silicon via Interposer 3D-IC
• https://doi.org/10.4071/2014DPC-tp14
IMAPSource Conference Papers
Uzoh, Cyprian, Liang Wang, Zhuowen Sun, Andrew Cao, Bong-Sub Lee, Guilian Gao, Hong Shen, and Sitaram Arkalgud. 2014. “Optimized TSV Module for High Performance 2.5D Device Packaging.” IMAPSource Proceedings 2014 (DPC): 737–67. https://doi.org/10.4071/2014DPC-tp14.
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