Uzoh, Cyprian, Liang Wang, Zhuowen Sun, Andrew Cao, Bong-Sub Lee, Guilian Gao, Hong Shen, and Sitaram Arkalgud. 2014. “Optimized TSV Module for High Performance 2.5D Device Packaging.”
IMAPSource Proceedings 2014 (DPC): 737–67.
https://doi.org/10.4071/2014DPC-tp14.