Vol. 2014, Issue DPC, 2014January 01, 2014 EDT
Optimized TSV Module for High Performance 2.5D Device Packaging
Optimized TSV Module for High Performance 2.5D Device Packaging
Cyprian Uzoh, Liang Wang, Zhuowen Sun, Andrew Cao, Bong-Sub Lee, Guilian Gao, Hong Shen, Sitaram Arkalgud,
Uzoh, Cyprian, Liang Wang, Zhuowen Sun, Andrew Cao, Bong-Sub Lee, Guilian Gao, Hong Shen, and Sitaram Arkalgud. 2014. “Optimized TSV Module for High Performance 2.5D Device Packaging.” IMAPSource Proceedings 2014 (DPC): 737–67. https://doi.org/10.4071/2014DPC-tp14.
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