Evaluation of Polymer Core Solderballs for Wafer Level Reliability Improvements

John Hunt; Adren Hsieh; Eddie Tsai; Chienfan Chen; Tsaiying Wang

doi:10.4071/2014DPC-ta24

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Hunt, John, Adren Hsieh, Eddie Tsai, Chienfan Chen, and Tsaiying Wang. 2014. “Evaluation of Polymer Core Solderballs for Wafer Level Reliability Improvements.” IMAPSource Proceedings 2014 (DPC): 545–66. https://doi.org/10.4071/2014DPC-ta24.

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