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Device Packaging Conference Presentations
Vol. 2014, Issue DPC, 2014January 01, 2014 EDT

Evaluation of Polymer Core Solderballs for Wafer Level Reliability Improvements

John Hunt, Adren Hsieh, Eddie Tsai, Chienfan Chen, Tsaiying Wang,
Solderballs Reliabilty WLCSP
• https://doi.org/10.4071/2014DPC-ta24
IMAPSource Conference Papers
Hunt, John, Adren Hsieh, Eddie Tsai, Chienfan Chen, and Tsaiying Wang. 2014. “Evaluation of Polymer Core Solderballs for Wafer Level Reliability Improvements.” IMAPSource Proceedings 2014 (DPC): 545–66. https://doi.org/10.4071/2014DPC-ta24.
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