Vol. 2014, Issue DPC, 2014January 01, 2014 EDT
Evaluation of Polymer Core Solderballs for Wafer Level Reliability Improvements
Evaluation of Polymer Core Solderballs for Wafer Level Reliability Improvements
John Hunt, Adren Hsieh, Eddie Tsai, Chienfan Chen, Tsaiying Wang,
Hunt, John, Adren Hsieh, Eddie Tsai, Chienfan Chen, and Tsaiying Wang. 2014. “Evaluation of Polymer Core Solderballs for Wafer Level Reliability Improvements.” IMAPSource Proceedings 2014 (DPC): 545–66. https://doi.org/10.4071/2014DPC-ta24.