Versatile Lead-Free Solder Electroplating Products for Advanced Bumping Technologies

Inho Lee; Regina Cho; Lou Grippo; Yen-Lin Taylor; Wayne Baldelli; Ryan Farrell; Julia Woertink; Yi Qin; Jonathan Prange; Yil-Hak Lee; Masaaki Imanari; Jianwei Dong; Jeff Calvert

doi:10.4071/2014DPC-wp22

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Lee, Inho, Regina Cho, Lou Grippo, Yen-Lin Taylor, Wayne Baldelli, Ryan Farrell, Julia Woertink, et al. 2014. “Versatile Lead-Free Solder Electroplating Products for Advanced Bumping Technologies.” IMAPSource Proceedings 2014 (DPC): 1603–21. https://doi.org/10.4071/2014DPC-wp22.

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