Vol. 2014, Issue DPC, 2014January 01, 2014 EDT
Versatile Lead-Free Solder Electroplating Products for Advanced Bumping Technologies
Versatile Lead-Free Solder Electroplating Products for Advanced Bumping Technologies
Inho Lee, Regina Cho, Lou Grippo, Yen-Lin Taylor, Wayne Baldelli, Ryan Farrell, Julia Woertink, Yi Qin, Jonathan Prange, Yil-Hak Lee, Masaaki Imanari, Jianwei Dong, Jeff Calvert,
Lee, Inho, Regina Cho, Lou Grippo, Yen-Lin Taylor, Wayne Baldelli, Ryan Farrell, Julia Woertink, et al. 2014. “Versatile Lead-Free Solder Electroplating Products for Advanced Bumping Technologies.” IMAPSource Proceedings 2014 (DPC): 1603–21. https://doi.org/10.4071/2014DPC-wp22.