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Device Packaging Conference Presentations
Vol. 2014, Issue DPC, 2014January 01, 2014 EDT

Precise solder dispensing in high-throughput micro-device packaging applications

Hanzhuang Liang, Linh Rolland, Floriana Suriawidjaja, Mani Ahmadi, Heakyoung Park,
solder paste dispensinghigh-precisionhigh-throughput
https://doi.org/10.4071/2014DPC-wa21
IMAPSource Conference Papers
Liang, Hanzhuang, Linh Rolland, Floriana Suriawidjaja, Mani Ahmadi, and Heakyoung Park. 2014. “Precise Solder Dispensing in High-Throughput Micro-Device Packaging Applications.” IMAPSource Proceedings 2014 (DPC): 1284–94. https:/​/​doi.org/​10.4071/​2014DPC-wa21.
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