Precise solder dispensing in high-throughput micro-device packaging applications

Hanzhuang Liang; Linh Rolland; Floriana Suriawidjaja; Mani Ahmadi; Heakyoung Park

doi:10.4071/2014DPC-wa21

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Liang, Hanzhuang, Linh Rolland, Floriana Suriawidjaja, Mani Ahmadi, and Heakyoung Park. 2014. “Precise Solder Dispensing in High-Throughput Micro-Device Packaging Applications.” IMAPSource Proceedings 2014 (DPC): 1284–94. https://doi.org/10.4071/2014DPC-wa21.

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