Vol. 2014, Issue DPC, 2014January 01, 2014 EDT
Precise solder dispensing in high-throughput micro-device packaging applications
Precise solder dispensing in high-throughput micro-device packaging applications
Hanzhuang Liang, Linh Rolland, Floriana Suriawidjaja, Mani Ahmadi, Heakyoung Park,
Liang, Hanzhuang, Linh Rolland, Floriana Suriawidjaja, Mani Ahmadi, and Heakyoung Park. 2014. “Precise Solder Dispensing in High-Throughput Micro-Device Packaging Applications.” IMAPSource Proceedings 2014 (DPC): 1284–94. https://doi.org/10.4071/2014DPC-wa21.