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Device Packaging Conference Presentations
Vol. 2014, Issue DPC, 2014January 01, 2014 EDT

ADVANCED ORGANIC SUBSTRATE TECHNOLOGIES FOR HIGH PERFORMANCE, HIGH RELIABILITY ELECTRONICS MINIATURIZATION

Susan Bagen, Dave Alcoe, Kim Blackwell, Frank Egitto,
chip package interactionorganic substratesflip chip
https://doi.org/10.4071/2014DPC-ta22
IMAPSource Conference Papers
Bagen, Susan, Dave Alcoe, Kim Blackwell, and Frank Egitto. 2014. “ADVANCED ORGANIC SUBSTRATE TECHNOLOGIES FOR HIGH PERFORMANCE, HIGH RELIABILITY ELECTRONICS MINIATURIZATION.” IMAPSource Proceedings 2014 (DPC): 501–25. https:/​/​doi.org/​10.4071/​2014DPC-ta22.
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