Vol. 2014, Issue DPC, 2014January 01, 2014 EDT
Through-Sapphire Via Filling Process Development for Backside Interconnect and Chip Stacking and Front-to-Back Daisy Chain Chip
Through-Sapphire Via Filling Process Development for Backside Interconnect and Chip Stacking and Front-to-Back Daisy Chain Chip
Ahmad, Syed Sajid, Fred Haring, Aaron Reinholz, and Nathan Schneck. 2014. “Through-Sapphire Via Filling Process Development for Backside Interconnect and Chip Stacking and Front-to-Back Daisy Chain Chip.” IMAPSource Proceedings 2014 (DPC): 1422–34. https://doi.org/10.4071/2014DPC-wp11.
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