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Device Packaging Conference Presentations
Vol. 2014, Issue DPC, 2014
January 01, 2014 EDT
Wet Chemical Processing with Megasonics Assist for the Removal of Bumping Process Photomasks
Sohn Hong Seong
,
John Tracy
,
photoresist stripping
micro-bumping
megasonics
•
https://doi.org/10.4071/2014DPC-tha14
IMAPSource Conference Papers
Seong, Sohn Hong, and John Tracy. 2014. “Wet Chemical Processing with Megasonics Assist for the Removal of Bumping Process Photomasks.”
IMAPSource Proceedings
2014 (DPC): 1966–81.
https://doi.org/10.4071/2014DPC-tha14
.
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