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Device Packaging Conference Presentations
Vol. 2014, Issue DPC, 2014
January 01, 2014 EDT
Solderability Challenges in Emerging BGA Packages
Maria Durham
,
Yan Liu
,
Andy Mackie
,
BGA Packages
Solderability
One-Step
•
https://doi.org/10.4071/2014DPC-tp25
IMAPSource Conference Papers
Durham, Maria, Yan Liu, and Andy Mackie. 2014. “Solderability Challenges in Emerging BGA Packages.”
IMAPSource Proceedings
2014 (DPC): 913–29.
https://doi.org/10.4071/2014DPC-tp25
.
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