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Device Packaging Conference Presentations
Vol. 2014, Issue DPC, 2014January 01, 2014 EDT

Solderability Challenges in Emerging BGA Packages

Maria Durham, Yan Liu, Andy Mackie,
BGA PackagesSolderabilityOne-Step
https://doi.org/10.4071/2014DPC-tp25
IMAPSource Conference Papers
Durham, Maria, Yan Liu, and Andy Mackie. 2014. “Solderability Challenges in Emerging BGA Packages.” IMAPSource Proceedings 2014 (DPC): 913–29. https:/​/​doi.org/​10.4071/​2014DPC-tp25.
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