Vol. 2014, Issue DPC, 2014January 01, 2014 EDT
Solderability Challenges in Emerging BGA Packages
Solderability Challenges in Emerging BGA Packages
Maria Durham, Yan Liu, Andy Mackie,
Durham, Maria, Yan Liu, and Andy Mackie. 2014. “Solderability Challenges in Emerging BGA Packages.” IMAPSource Proceedings 2014 (DPC): 913–29. https://doi.org/10.4071/2014DPC-tp25.