Control of Bump Morphology in Lead Free Solder Plating for Higher Density Packaging

Koji Tatsumi; Kyouhei Mineo; Takeshi Hatta; Takuma Katase; Masayuki Ishikawa; Akihiro Masuda

doi:10.4071/2014DPC-wp24

Loading [Contrib]/a11y/accessibility-menu.js

Tatsumi, Koji, Kyouhei Mineo, Takeshi Hatta, Takuma Katase, Masayuki Ishikawa, and Akihiro Masuda. 2014. “Control of Bump Morphology in Lead Free Solder Plating for Higher Density Packaging.” IMAPSource Proceedings 2014 (DPC): 1643–69. https://doi.org/10.4071/2014DPC-wp24.

View more stats