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Device Packaging Conference Presentations
Vol. 2014, Issue DPC, 2014
January 01, 2014 EDT
Control of Bump Morphology in Lead Free Solder Plating for Higher Density Packaging
Koji Tatsumi
,
Kyouhei Mineo
,
Takeshi Hatta
,
Takuma Katase
,
Masayuki Ishikawa
,
Akihiro Masuda
,
Lead Free Plating Chemical
Solder Bumping
Cu Pillar
•
https://doi.org/10.4071/2014DPC-wp24
IMAPSource Conference Papers
Tatsumi, Koji, Kyouhei Mineo, Takeshi Hatta, Takuma Katase, Masayuki Ishikawa, and Akihiro Masuda. 2014. “Control of Bump Morphology in Lead Free Solder Plating for Higher Density Packaging.”
IMAPSource Proceedings
2014 (DPC): 1643–69.
https://doi.org/10.4071/2014DPC-wp24
.
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