ISSN 2380-4505
Vol. 2014, Issue DPC, 2014January 01, 2014 EDT
Control of Bump Morphology in Lead Free Solder Plating for Higher Density Packaging
Control of Bump Morphology in Lead Free Solder Plating for Higher Density Packaging
Koji Tatsumi, Kyouhei Mineo, Takeshi Hatta, Takuma Katase, Masayuki Ishikawa, Akihiro Masuda,
Tatsumi, Koji, Kyouhei Mineo, Takeshi Hatta, Takuma Katase, Masayuki Ishikawa, and Akihiro Masuda. 2014. “Control of Bump Morphology in Lead Free Solder Plating for Higher Density Packaging.” IMAPSource Proceedings 2014 (DPC): 1643–69. https://doi.org/10.4071/2014DPC-wp24.