A Flexible Manufacturing Method for Wafer Level Packages

Tom Strothmann; Damien Pricolo; Seung Wook Yoon; Yaojian Lin

doi:10.4071/2014DPC-tp21

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Strothmann, Tom, Damien Pricolo, Seung Wook Yoon, and Yaojian Lin. 2014. “A Flexible Manufacturing Method for Wafer Level Packages.” IMAPSource Proceedings 2014 (DPC): 815–29. https://doi.org/10.4071/2014DPC-tp21.

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