Vol. 2014, Issue DPC, 2014January 01, 2014 EDT
A Flexible Manufacturing Method for Wafer Level Packages
A Flexible Manufacturing Method for Wafer Level Packages
Tom Strothmann, Damien Pricolo, Seung Wook Yoon, Yaojian Lin,
Strothmann, Tom, Damien Pricolo, Seung Wook Yoon, and Yaojian Lin. 2014. “A Flexible Manufacturing Method for Wafer Level Packages.” IMAPSource Proceedings 2014 (DPC): 815–29. https://doi.org/10.4071/2014DPC-tp21.