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Device Packaging Conference Presentations
Vol. 2014, Issue DPC, 2014
January 01, 2014 EDT
A Flexible Manufacturing Method for Wafer Level Packages
Tom Strothmann
,
Damien Pricolo
,
Seung Wook Yoon
,
Yaojian Lin
,
WLP
Manufacturing
Method
•
https://doi.org/10.4071/2014DPC-tp21
IMAPSource Conference Papers
Strothmann, Tom, Damien Pricolo, Seung Wook Yoon, and Yaojian Lin. 2014. “A Flexible Manufacturing Method for Wafer Level Packages.”
IMAPSource Proceedings
2014 (DPC): 815–29.
https://doi.org/10.4071/2014DPC-tp21
.
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