Vol. 2014, Issue DPC, 2014January 01, 2014 EDT
Heterogeneous Integration of Photonic Integrated Circuits Using 3D Assembly Techniques: Silicon Technology and Packaging
Heterogeneous Integration of Photonic Integrated Circuits Using 3D Assembly Techniques: Silicon Technology and Packaging
Yann Lamy, Haykel Ben Jamaa, Hughes Metras, Stéphane Bernabé, Sylvie Menezo, Laurent Fulbert,
Lamy, Yann, Haykel Ben Jamaa, Hughes Metras, Stéphane Bernabé, Sylvie Menezo, and Laurent Fulbert. 2014. “Heterogeneous Integration of Photonic Integrated Circuits Using 3D Assembly Techniques: Silicon Technology and Packaging.” IMAPSource Proceedings 2014 (DPC): 2057–86. https://doi.org/10.4071/2014DPC-tha31.