Vol. 2014, Issue DPC, 2014January 01, 2014 EDT
Wafer level packaging for high-brightness LED lighting with optimized thermal dissipation and optical performance
Wafer level packaging for high-brightness LED lighting with optimized thermal dissipation and optical performance
Liang Wang, Gabe Guevara, Rey Co, Ron Zhang, Roseann Alatorre,
Wang, Liang, Gabe Guevara, Rey Co, Ron Zhang, and Roseann Alatorre. 2014. “Wafer Level Packaging for High-Brightness LED Lighting with Optimized Thermal Dissipation and Optical Performance.” IMAPSource Proceedings 2014 (DPC): 1787–1817. https://doi.org/10.4071/2014DPC-wp35.