Vol. 2014, Issue DPC, 2014January 01, 2014 EDT
2D PCB WITH 3D PRINT FABRICATIONS FOR RIGID-CONFORMAL PACKAGING OF MICROSENSOR IMAGING ARRAYS BASED ON BIOINSPIRED ARCHITECTURES
2D PCB WITH 3D PRINT FABRICATIONS FOR RIGID-CONFORMAL PACKAGING OF MICROSENSOR IMAGING ARRAYS BASED ON BIOINSPIRED ARCHITECTURES
Fries, David, and Chase StarrGeran Barton. 2014. “2D PCB WITH 3D PRINT FABRICATIONS FOR RIGID-CONFORMAL PACKAGING OF MICROSENSOR IMAGING ARRAYS BASED ON BIOINSPIRED ARCHITECTURES.” IMAPSource Proceedings 2014 (DPC): 1012–45. https://doi.org/10.4071/2014DPC-tp33.
Powered by Scholastica, the modern academic journal management system