Vol. 2014, Issue DPC, 2014January 01, 2014 EDT
Sapphire Surface Protection During Sapphire Micromachining and Through-Sapphire Via Formation for Device Densification, Backside Interconnect and Chip Stacking
Sapphire Surface Protection During Sapphire Micromachining and Through-Sapphire Via Formation for Device Densification, Backside Interconnect and Chip Stacking
Ahmad, Syed Sajid, Fred Haring, Greg Strommen, Kevin Mattson, and Aaron Reinholz. 2014. “Sapphire Surface Protection During Sapphire Micromachining and Through-Sapphire Via Formation for Device Densification, Backside Interconnect and Chip Stacking.” IMAPSource Proceedings 2014 (DPC): 1362–79. https://doi.org/10.4071/2014DPC-wa31.
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