Vol. 2014, Issue DPC, 2014January 01, 2014 EDT
A New Type of TSV Defect Caused by BMD in Silicon Substrate
A New Type of TSV Defect Caused by BMD in Silicon Substrate
Dingyou Zhang, Sarasvathi Thangaraju, Daniel Smith, Himani Kamineni, Christian Klewer, Mark Scholefield, Ming Lei, Tong Qing Chen, Kumarapuram Gopalakrishnan, Abhishek Vikram, Victor Lim, Wonwoo Kim, Ramakanth Alapati,
Zhang, Dingyou, Sarasvathi Thangaraju, Daniel Smith, Himani Kamineni, Christian Klewer, Mark Scholefield, Ming Lei, et al. 2014. “A New Type of TSV Defect Caused by BMD in Silicon Substrate.” IMAPSource Proceedings 2014 (DPC): 1506–22. https://doi.org/10.4071/2014DPC-wp14.