Vol. 2014, Issue DPC, 2014January 01, 2014 EDT
TSV technology embedding high density capacitors for Advanced 3D packaging solutions
TSV technology embedding high density capacitors for Advanced 3D packaging solutions
Catherine Bunel, Florent Lallemand,
Bunel, Catherine, and Florent Lallemand. 2014. “TSV Technology Embedding High Density Capacitors for Advanced 3D Packaging Solutions.” IMAPSource Proceedings 2014 (DPC): 1208–37. https://doi.org/10.4071/2014DPC-wa11.