TSV technology embedding high density capacitors for Advanced 3D packaging solutions

Catherine Bunel; Florent Lallemand

doi:10.4071/2014DPC-wa11

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Bunel, Catherine, and Florent Lallemand. 2014. “TSV Technology Embedding High Density Capacitors for Advanced 3D Packaging Solutions.” IMAPSource Proceedings 2014 (DPC): 1208–37. https://doi.org/10.4071/2014DPC-wa11.

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