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Device Packaging Conference Presentations
Vol. 2014, Issue DPC, 2014January 01, 2014 EDT

TSV technology embedding high density capacitors for Advanced 3D packaging solutions

Catherine Bunel, Florent Lallemand,
3D Silicon Capacitors TSV Advanced packaging solutions
• https://doi.org/10.4071/2014DPC-wa11
IMAPSource Conference Papers
Bunel, Catherine, and Florent Lallemand. 2014. “TSV Technology Embedding High Density Capacitors for Advanced 3D Packaging Solutions.” IMAPSource Proceedings 2014 (DPC): 1208–37. https://doi.org/10.4071/2014DPC-wa11.
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