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Device Packaging Conference Presentations
Vol. 2014, Issue DPC, 2014
January 01, 2014 EDT
TSV technology embedding high density capacitors for Advanced 3D packaging solutions
Catherine Bunel
,
Florent Lallemand
,
3D Silicon Capacitors
TSV
Advanced packaging solutions
•
https://doi.org/10.4071/2014DPC-wa11
IMAPSource Conference Papers
Bunel, Catherine, and Florent Lallemand. 2014. “TSV Technology Embedding High Density Capacitors for Advanced 3D Packaging Solutions.”
IMAPSource Proceedings
2014 (DPC): 1208–37.
https://doi.org/10.4071/2014DPC-wa11
.
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