Vol. 2014, Issue DPC, 2014January 01, 2014 EDT
Adhesive Enabling Technology for Direct Metal Deposition on Molding Resin
Adhesive Enabling Technology for Direct Metal Deposition on Molding Resin
Kenichiroh Mukai, Kwonil Kim, Brian Eastep, Lee Gaherty, Anirudh Kashyap, Lutz Brandt,
Mukai, Kenichiroh, Kwonil Kim, Brian Eastep, Lee Gaherty, Anirudh Kashyap, and Lutz Brandt. 2014. “Adhesive Enabling Technology for Direct Metal Deposition on Molding Resin.” IMAPSource Proceedings 2014 (DPC): 1670–93. https://doi.org/10.4071/2014DPC-wp25.