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Device Packaging Conference Presentations
Vol. 2014, Issue DPC, 2014January 01, 2014 EDT

Adhesive Enabling Technology for Direct Metal Deposition on Molding Resin

Kenichiroh Mukai, Kwonil Kim, Brian Eastep, Lee Gaherty, Anirudh Kashyap, Lutz Brandt,
EM ShieldingMolding resinMiniaturization
https://doi.org/10.4071/2014DPC-wp25
IMAPSource Conference Papers
Mukai, Kenichiroh, Kwonil Kim, Brian Eastep, Lee Gaherty, Anirudh Kashyap, and Lutz Brandt. 2014. “Adhesive Enabling Technology for Direct Metal Deposition on Molding Resin.” IMAPSource Proceedings 2014 (DPC): 1670–93. https:/​/​doi.org/​10.4071/​2014DPC-wp25.
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