Adhesive Enabling Technology for Direct Metal Deposition on Molding Resin

Kenichiroh Mukai; Kwonil Kim; Brian Eastep; Lee Gaherty; Anirudh Kashyap; Lutz Brandt

doi:10.4071/2014DPC-wp25

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Mukai, Kenichiroh, Kwonil Kim, Brian Eastep, Lee Gaherty, Anirudh Kashyap, and Lutz Brandt. 2014. “Adhesive Enabling Technology for Direct Metal Deposition on Molding Resin.” IMAPSource Proceedings 2014 (DPC): 1670–93. https://doi.org/10.4071/2014DPC-wp25.

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