Vol. 2014, Issue DPC, 2014January 01, 2014 EDT
Optimization of Lead Free Plating for Flip Chip Applications
Optimization of Lead Free Plating for Flip Chip Applications
Charles L. Arvin, Jurg Stahl, Wolfgang Sauter, Harry cox, Eric Perfecto, Valerie Oberson, Nathalie Normand,
Arvin, Charles L., Jurg Stahl, Wolfgang Sauter, Harry cox, Eric Perfecto, Valerie Oberson, and Nathalie Normand. 2014. “Optimization of Lead Free Plating for Flip Chip Applications.” IMAPSource Proceedings 2014 (DPC): 1553–1602. https://doi.org/10.4071/2014DPC-wp21.
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